Cooler Master Thermal Fusion 400
Not Rated
Cooler Master

Cooler Master Thermal Fusion 400

Not Rated
Cooler Master
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ThermalFusion 400 is a supremethermal compound that includes highthermal conductivity with low thermalresistance. Its non-curing and nonelectricalconductive traits can avoid anyshort circuit incidence. ThermalFusion400 is the ultimate solution for thermaldissipation to improve CPU, GPU coolingand other bonding applications.


  • High Thermal Conductivity
  • Low Thermal Resistance
  • Non-Curing
  • Non-Electrical Conductive
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Color Gray
Specific Gravity (25?) 3.5
Thermal Conductivity (W/m-K) 2.89
Volume Resistivity (ohm-cm) 2.00E+10
Thermal Resistance ( -cm²/W) 0.032
Bond Line Thickness (mm) 0.008
Volatile Content (%) <0.1
Net Weight (g) 4


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